Sensor based registration and stacking of electronic substrate layers
نویسندگان
چکیده
منابع مشابه
Sensor based registration and stacking of electronic substrate layers
Substrates for most of today's electronic products contain many wiring layers which are individually fabricated, mechanically registered with one another, and laminated together. Alignment tolerances of 0.05 mm to 0.1 mm are su cient to register the vertical connection pads or vias on each layer. More aggressive designs of the future will, however, require manufacturing accuracies of at least a...
متن کاملSensor - based Registration and Stackingof Electronic Substrate
Substrates for most of today's electronic products contain many wiring layers which are individually fabricated, mechanically registered with one another, and laminated together. Alignment tolerances of 0.05 mm to 0.1 mm are suucient to register the vertical connection pads or vias on each layer. More aggressive designs of the future will, however, require manufacturing accuracies of at least a...
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ژورنال
عنوان ژورنال: IEEE Robotics & Automation Magazine
سال: 1995
ISSN: 1070-9932
DOI: 10.1109/100.476627